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| New Product SI2316BDS Vishay Siliconix N-Channel 30-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 rDS(on) () 0.050 at VGS = 10 V 0.080 at VGS = 4.5 V ID (A)a 4.5 3.16 nC 3.4 Qg (Typ) FEATURES * TrenchFET(R) Power MOSFET * PWM Optimized * 100 % Rg tested RoHS COMPLIANT APPLICATIONS * Battery Switch * DC/DC Converter TO-236 (SOT-23) G 1 3 D S 2 Top View Si2316DS (M6)* *Marking Code Ordering Information: SI2316BDS-T1-E3 (Lead (Pb)-free) ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 C TC = 70 C TA = 25 C TA = 70 C TC = 25 C TA = 25 C TC = 25 C TC = 70 C TA = 25 C TA = 70 C Symbol VDS VGS ID Limit 30 20 4.5 3.6 3.9b, c 3.13b, c 20 1.39 1.04b, c 1.66 1.06 1.25b, c 0.8b, c - 55 to 150 Unit V Continuous Drain Current (TJ = 150 C) A Pulsed Drain Current Continuous Source-Drain Diode Current IDM IS Maximum Power Dissipation PD W Operating Junction and Storage Temperature Range TJ, Tstg C THERMAL RESISTANCE RATINGS Parameter 5 sec Maximum Junction-to-Ambientb, d Maximum Junction-to-Foot (Drain) Steady State Notes: a. Based on TC = 25 C. b. Surface Mounted on 1" x 1" FR4 Board. c. t = 5 sec. d. Maximum under Steady State conditions is 130 C/W. Document Number: 70445 S-71330-Rev. A, 02-Jul-07 Symbol RthJA RthJF Typical 80 60 Maximum 100 75 Unit C/W www.vishay.com 1 New Product SI2316BDS Vishay Siliconix MOSFET SPECIFICATIONS TJ = 25 C, unless otherwise noted Parameter Static Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Dynamicb Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time Currenta IS ISM VSD trr Qrr ta tb IF = 2.0 A, di/dt = 100 A/s, TJ = 25 C IS = 2.0 A 0.8 10 4 6.6 3.5 ns TC = 25 C 1.39 20 1.2 15 6 A V ns nC Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf td(on) tr td(off) tf VDD = 15 V, RL = 6.25 ID = 2.4 A, VGEN = 4.5 V, RG = 1 VDD = 15 V, RL = 4.8 ID 3.13 A, VGEN = 10 V, RG = 1 f = 1 MHz VDS = 15 V, VGS = 0 V, f = 1 MHz VDS = 15 V, VGS = 10 V, ID = 3.9 A VDS = 15 V, VGS = 4.5 V, ID = 3.9 A 350 65 37 6.35 3.16 1.56 1.1 2.6 4.5 11 12 7 20 65 11 23 3.9 6.75 16.5 18 10.5 30 98 17 35 ns ns 9.6 4.8 nC pF VDS VDS/TJ VGS(th)/TJ VGS(th) IGSS IDSS ID(on) rDS(on) gfs VDS = 0 V, ID = 250 A ID = 250 A VDS = VGS, ID = 250 A VDS = 0 V, VGS = 20 V VDS = 30 V, VGS = 0 V VDS = 30 V, VGS = 0 V, TJ = 55 C VDS 5 V, VGS = 10 V VGS = 10 V, ID = 3.9 A VGS = 4.5 V, ID = 3.3 A VDS = 15V, ID = 3.9 A 20 0.041 0.064 6 0.050 0.080 1 30 23.92 5.2 3 100 1 10 V mV/C V nA A A S Symbol Test Conditions Min Typ Max Unit Notes: a. Pulse test; pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 Document Number: 70445 S-71330-Rev. A, 02-Jul-07 New Product SI2316BDS Vishay Siliconix TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 20 VGS = 10 thru 5 V I D - Drain Current (A) I D - Drain Current (A) 15 3 2 10 VGS = 4 V 5 1 TJ = 25 C VGS = 3 V 0 0 1 2 3 4 5 0 0 TJ = 125 C TJ = - 55 C 1 2 3 4 5 VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V) Output Characteristics 0.20 500 Transfer Characteristics rDS(on) - On-Resistance () 0.16 C - Capacitance (pF) VGS = 4.5 V 0.12 400 300 Ciss 0.08 VGS = 10 V 200 Coss 100 0.04 0.00 0 4 8 12 16 20 0 0 Crss 6 12 18 24 30 ID - Drain Current (A) VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current and Gate Voltage 10 ID = 3.9 A VGS - Gate-to-Source Voltage (V) 8 rDS(on) - On-Resistance (Normalized) VDS = 16 V 6 1.6 1.8 Capacitance VGS = 10 V, I D = 3.9 A 1.4 1.2 VGS = 4.5 V, ID = 3.3 A 1.0 4 VDS = 24 V 2 0.8 0 0 2 4 6 8 0.6 - 50 - 25 0 25 50 75 100 125 150 Qg - Total Gate Charge (nC) TJ - Junction Temperature (C) Gate Charge On-Resistance vs. Junction Temperature Document Number: 70445 S-71330-Rev. A, 02-Jul-07 www.vishay.com 3 New Product SI2316BDS Vishay Siliconix TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 100 rDS(on) - Drain-to-Source On-Resistance () 0.12 ID = 4.1 A 0.09 TA = 125 C 0.06 10 I S - Source Current (A) 1 TJ = 150 C 0.1 TJ = 25 C 0.03 TA = 25 C 0.01 0.0 0.00 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage 2.6 10 On-Resistance vs. Gate-to-Source Voltage 2.4 8 2.2 VGS(th) (V) ID = 250 A 2.0 Power (W) 6 TA = 25 C Single Pulse 4 1.8 2 1.6 1.4 - 50 - 25 0 25 50 75 100 125 150 0 0.01 0.1 TJ - Temperature ( C) 1 10 Time (sec) 100 600 Threshold Voltage 100 *rDS(on) Limited 10 I D - Drain Current (A) 10 ms 1 100 ms 1s 0.1 TA = 25 C Single Pulse 10 s dc 0.01 Single Pulse Power 0.001 0.1 *VGS 1 10 100 VDS - Drain-to-Source Voltage (V) minimum VGS at which rDS(on) is specified Safe Operating Area www.vishay.com 4 Document Number: 70445 S-71330-Rev. A, 02-Jul-07 New Product SI2316BDS Vishay Siliconix TYPICAL CHARACTERISTICS 25 C, unless otherwise noted 5 2.0 4 ID - Drain Current (A) 1.6 3 Power 1.2 2 0.8 1 0.4 0 0 25 50 75 100 125 150 0.0 0 25 50 75 100 125 150 TC - Case Temperature (C) TC - Case Temperature (C) Current Derating* Power Derating, Junction-to-Foot *The power dissipation PD is based on TJ(max) = 150 C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: 0.1 0.1 PDM 0.05 t1 0.02 t2 1. Duty Cycle, D = 3. T JM 2. Per Unit Base = R thJA = 130 C/W t1 t2 Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 1 Square Wave Pulse Duration (sec) TA = PDMZthJA(t) 4. Surface Mounted 10 100 600 Normalized Thermal Transient Impedance, Junction-to-Ambient Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?70445 Document Number: 70445 S-71330-Rev. A, 02-Jul-07 www.vishay.com 5 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1 |
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